Slurry Delivery System

A system that manufactures various film-removing abrasive solutions (Slurry), ultrapure water (DIW), and fruit (H2O2) required for semiconductor manufacturing CMP processes at a fixed ratio and supplies them stably to polishing equipment (POLISHER)
Technology Overview and Features

- Customized design for optimization considering the characteristics of various slurries
- Accurate PLC control and MMI implementation based on Load Cell 
- Auto Control Features in Piping Roof Flow and Pressure
- Application of technology involving large particle control technology in addition to the Filter Auto Wetting & Change function

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